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S_x96x_S
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válasz Petykemano #9005 üzenetére
> Az elmúlt napokban az Intel elég sok fejlesztést bemutatott.
az Inteles 3D V-Cache -ra kiváncsi leszek ..
Intel Adopting 3D-Stacked Cache for CPUs, Challenging AMD's 3D V-Cache
https://www.tomshardware.com/news/intel-will-adopt-3d-stacked-cache-for-cpus-says-ceo-pat-gelsinger""
"We feel very good that we have advanced capabilities for next-generation memory architectures, advantages for 3D stacking, for both little die, as well as for very big packages for AI and high-performance servers as well. So we have a full breadth of those technologies. We'll be using those for our products, as well as presenting it to the Foundry (IFS) customers as well," Gelsinger concluded.
It's logical that Intel could adopt this sort of technology; the hybrid bonding technology behind 3D V-Cache isn't proprietary to AMD -- it's enabled by TSMC's SoIC packaging technology. Additionally, this sort of chip architecture has been on the long-term horizon for chip makers for several years.
Stacked cache has proven to be a strategic advantage for AMD, as it powers the company's Ryzen X3D CPUs, which are the fastest gaming processors in the world. It's also a strong value add for its X-series EPYC processors, like Genoa-X. Now it appears that Intel will also throw its hat into the ring with this tech, too.
"""[ Szerkesztve ]
Mottó: "A verseny jó!"
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